| Resistance |
Measuring resistance value at room temperature 25℃±5℃ |
Refer to Spec |
IEC60115-1 4.5 |
| Temperature coefficient of resistance |
TCR =(R-R0)/R0(T2-T1)X 106 T1 T2 R0 : resistance of room temperature R: resistance of 125℃ T1: Room temperature T2: Temperature at 125℃ |
Refer to Spec |
MIL-STD-202 Method 304 |
| Short time Overload |
Apply overload for 5 seconds and measure the resistance change rate after standing for 24 hours. 5 times the rated power for 5 seconds |
≤±1% |
MIL-R-26E |
| Resistance to Soldering Heat |
260℃± 5℃ time ：10sec± 1sec |
≤±0.5% |
MIL-STD-202 Method 210 |
| Temperature Cycling |
-55℃ (15min)/+125℃(15min), 1000 cycles |
≤±1% |
MIL-STD-202 Method107G |
| Low temperature Storage |
-55℃ for 1000hours, No power |
≤±1% |
MIL-STD-26E |
| High Temperature Storage |
125℃ for 1000hours, No power |
≤±1% |
IEC6011501-4.25 |
| Bias Humidity |
+85℃, 85% RH ，10%bias1.5 hours “ON”, 0.5 hours “OFF” , 1000hours |
≤±1% |
MIL-STD-202 Method103 |
| Solderability |
235±3℃ , 3±0.5sec |
At least 95% of surface area of electrode shall be covered with new solder |
IEC60115-1-4.17 JIS-C5201-4.17 |
| Substrate Bending |
Bending width 3mm |
< ±1% |
IEC60115-1-4.33 JIS-C5201-4.33 |
| Operational life |
125℃, 1000 hours, at 35% rated power |
≤±2% |
MIL-STD-202 Method 108 |
| Insulation Resistance |
100V DC for 1 minute |
>100 MΩ |
IEC60115-1-4.6 JIS-C5201-4.6 |
