PMS45
Features
- Molded high temperature encapsulation.
- Improved thermal management incorporated into design.、
- All welded construction of the Power Metal Strip resistors are ideal for all types of current sensing, voltage division and pulse applications.
- Sulfur resistance by construction that is unaffected by high sulfur environments.
- Solid metal nickel-chrome or manganese- copper alloy resistive element with low TCR (< 20 ppm/°C)
- Very low inductance 0.5 nH to 10 nH.
- Low thermal EMF (< 5 μV/°C)
Part number
PMS 45 F 5P0 R120
【1】 【2】【3】 【4】 【5】
【1】Series Name: Power Metal Strip Resistors.
【2】Chip Size: 45: 4527.
【3】 Resistance Precision: F: ±1%.
【4】 Power Rating: 5P0: 5W.
【5】 Resistance Code: R080:80mΩ , R120:120mΩ , 8M20:8.2mΩ .
Electrical Characteristics
| Size | Power Rating at 70℃(W) | Resistance Range (mΩ)* ±1% | Element TCR ( ppm/℃) | Operation Temperature Range | Product temperature coefficient (ppm/℃) | Insulation resistance |
|---|---|---|---|---|---|---|
| 4527 | 5 | 5~120 | ＜20 | -55℃~+170℃ | ±75：10mΩ≤R≤120mΩ ±110 ：5mΩ≤R＜10mΩ | >109 |
“*” : Other values may be available, contact factory
1) Ir =(P/R)1/2 R: Resistance Value Ir: Rating Current P: Rating Power;
2) Product temperature coefficient: Includes the TCR effects of the resistor element and the copper terminal.
Physical Dimensions
| Type | Resistance (mΩ) | L | H | T | W | W1 |
|---|---|---|---|---|---|---|
| PMS45 | 5~120 | 11.60±0.60 | 2.50±0.30 | 2.80±0.50 | 7.00±0.3 | 5.46±0.20 |
Recommended Solder Pad Layout
Unit: mm
| Type | a | b | c | I |
|---|---|---|---|---|
| PMS45 | 3.94 | 5.84 | 0.51 | 5.21 |
Marking Instructions
PMS45 is marked with four digit, We have two different ways of marking：
a. “ R ” designates the decimal location in ohms,
e. g. 80mΩ: R080； 120mΩ: R120
b. “m” designates the decimal location in milliohms,
e. g. 8.2mΩ: 8m20
Power Derating Curve
For resistors operated in ambient temperatures 70°C, power rating shall be derated in according with the curve below:
Recommended Solder Curve
| Reflow Condition | Pb - Free assembly | |
|---|---|---|
| Pre heat | - Temperature Min (Ts(min)) | 150°C |
| - Temperature Max (Ts(max)) | 200°C | |
| - Time (Minto Max) (ts) | 60-120secs | |
| Average ramp up rate (Liquidus Temp (TL)to peak | 5°C/second max | |
| TS(max) to TL - Ramp-up Rate | 5°C/second max | |
| Reflow | - Temperature (TL) (Liquidus) | 217°C |
| - Time (tL) | 60 - 150 seconds | |
| Peak Temperature (TP) | 260°C | |
| Time within 5°C of actual peakTemperature (t ) | 20 - 40 seconds | |
| Ramp-down Rate | 5°C/second max | |
| Time 25°C to peak Temperature (TP) | 8 minutes Max. | |
| Wave Soldering | 260°C, 10 seconds max. | |
| Hand Soldering | 350°C, 5 seconds max. | |
Product Characteristics
| Item | Test condition/ Methods | Limited | Standard |
|---|---|---|---|
| Resistance | Measuring resistance value at room temperature 25℃±5℃ | Refer to Spec | IEC60115-1 4.5 |
| Temperature coefficient of resistance | TCR =(R-R0)/R0(T2-T1)X 106 R0 : resistance of room temperature R: resistance of 125℃ T1 : Room temperature T2 : Temperature at 125℃ | Refer to Spec | MIL-STD-202 Method 304 |
| Short time Overload | 3 times the rated power for 5 seconds | ≤±2% | MIL-R-26E |
| Resistance to Soldering Heat | 260℃±5℃ time ：12sec± 0.5sec | ≤±0.5% | MIL-STD-202 Method 210 |
| Solderability | 235℃±5℃ time ： 2sec± 0.5sec | 95% coverage minimum | J-STD-202 |
| Temperature Cycling | -55℃ (15min)/+150℃(15min), 1000 cycles | ≤±0.5% | MIL-STD-202 Method107G |
| Low temperature Storage | -55℃ for 24 hours, No power | ≤±0.5% | MIL-STD-26E |
| High Temperature Storage | 170℃ for 1000hours, No power | ≤±1% | IEC60115-1 4.25 |
| Bias Humidity | +85℃ , 85% RH ，10%bias, 1000hours | ≤±0.5% | MIL-STD-202 Method103 |
| Mechanical shock | Condition C , 100 g’s ,6 msec, 3 mutually perpendicular axes, in 6 directions, three impacts each for a total of 18 times 18 shocks. | ≤±0.5% | MIL-STD-202 Method 213 |
| Vibration | The frequency varies from 10HZ to 55HZ and return to 10HZ, shall be transferred in 1 min. Amplitude : 1.5mm, 3 directions, and 12 hours | ≤±0.5% | MIL-STD-202 Method 201 |
| Bending | Span between fulcrums ：90mm ; Bend Width ：2mm; Test board ：Glass-Epoxy Board Thickness =1.6mm Durations:60＋5s | ≤±1% | IEC60115-1 4.33 |
| Operational life | 70℃±2℃, 1000 hours, at rated power | ≤±2% | MIL-STD-202 Method 108 |
| Moisture resistance | MIL-STD-202,method106 ， No power, 7b not required | ≤±0.5% | MIL-STD-202 Method 106 |
Packaging
Tape Dimensions
| Series | Type | A | B | D0 | E | F | φD1 |
|---|---|---|---|---|---|---|---|
| 4527 | 5-120mΩ | 7.28±0.10 | 11.86±0.10 | 1.50±0.10 | 1.75±0.10 | 11.50±0.10 | 1.50±0.10 |
| Series | Type | W | P0 | P1 | P2 | T | |
| 4527 | 5-120mΩ | 24.0±0.30 | 4.00±0.10 | 12.0±0.10 | 2.00±0.10 | 2.71±0.10 |
Reel Dimensions
| Series | Type | W (mm) | M (mm) | ΦA (mm) | N (mm) | H1 (mm) | H2 (mm) |
|---|---|---|---|---|---|---|---|
| 4527 | 13’ reel | 24.4±1.0 | 330.0±2.0 | 13.4±0.5 | 100.0±0.2 | 24.4±1.0 | 28.6±1.0 |
Quantity of Package
| Type | Quantity (pcs） |
|---|---|
| 4527 | 1500 |
Storage
1. The temperature condition must be controlled at 25±5℃, The R.H. must be controlled at 60±15% Store in accordance with this requirement, and the validity period is two years after the date of manufacture.
2. Please avoid the mentioned harsh environment below when storing to ensure product performance and its’ weldability. Places exposed to sea breeze or other corrosive gas, such as Cl2 , H2S, NH3 , SO2 and NO2 .
3. When the product is moved and stored, please ensure the correct orientation of the box. Do not drop or squeeze the box. Otherwise, the electrode or the body of the product may be damaged.