LMR28
Description
- Welded construction product
- Resistance range 1~100mR
- Rated power 4~5W
- Low inductance design
- Alloy Material, Shock Resistance
- Operating temperature range:- 65℃ ~170℃
Applications
- Current sensing application
- Over current protection
- Servo motor control circuits
- Inverter power
- Electric control system
- Li-battery management system
Part number
LMR 28 F 4P0 R005
【 1】 【2】 【3】 【4】 【5】
【 1 】Series Name: Low resistence Metal strip Chip Resistors
【2 】Chip size: 28:2817
【3】 Resistance Precision: D:±0.5% ; F:±1% ; G:±2% ; J:±5%
【4】 Power Rating:4P0=4W ; 5P0=5W
【5】 Resistance Code: R005: 5mΩ ; R050: 50mΩ
Standard Electrical Specifications
Size | Power (W)(1) | Resistance/mΩ | TCR (ppm/℃) | Material | Operating Temperature (℃) |
---|---|---|---|---|---|
±0.5%, ±1% ±2%,±5% | |||||
2817 | 4,5 | 1~3 | ±75 | Manganin Kamar | -65℃~170℃ |
4~50 *51~100 | ±50 |
Note: (1) Products of different sizes are being verified by power rating tests at other ambient temperatures.
* Short Time Overload were tested with 2.5×Rated power for 10 s\
Products & Recommend Pad Dimension
Unit:mm
Type | Resistance | W±0.2 | C±0.2 | A±0.2 | D±0.1 | L | a | c |
---|---|---|---|---|---|---|---|---|
2817 | 1~4 | 7.1 | 4.3 | 1.2 | 0.8 | 3.5 | 2.7 | 5.2 |
5 ~ 100 |
Welded Construction
Power Derating Curve
For resistors operated in ambient temperatures 70°C, power ratingshall bederated inaccording with the curve below:
Recommended Solder Curve
Reflow Condition | Pb – Free assembly | |
---|---|---|
Pre heat | - Temperature Min (Ts(min)) | 150°C |
- Temperature Max (Ts(max)) | 200°C | |
- Time (Min to Max) (ts) | 60 – 120 secs | |
Average ramp up rate (Liquidus Temp (TL) to peak | 5°C/second max | |
TS(max) to TL - Ramp-up Rate | 5°C/second max | |
Reflow | - Temperature (TL) (Liquidus) | 217°C |
- Temperature (tL) | 60 – 150 seconds | |
Peak Temperature (TP) | 260°C | |
Time within 5°C of actual peak Temperature (tp) | 20 – 40 seconds | |
Ramp-down Rate | 5°C/second max | |
Time 25°C to peak Temperature (TP) | 8 minutes Max. | |
Wave Soldering | 260°C, 10 seconds max. | |
Hand Soldering | 350°C, 5 seconds max. |
Products & Recommend Pad Dimension
Unit:mm
Type | Resistance | W±0.2 | C±0.2 | A±0.2 | D±0.1 | L | a | c |
---|---|---|---|---|---|---|---|---|
2817 | 1~4 | 7.1 | 4.3 | 1.2 | 0.8 | 3.5 | 2.7 | 5.2 |
5 ~ 100 |
Welded Construction
Power Derating Curve
For resistors operated in ambient temperatures 70°C, power ratingshall bederated inaccording with the curve below:
Recommended Solder Curve
Reflow Condition | Pb – Free assembly | |
---|---|---|
Pre heat | - Temperature Min (Ts(min)) | 150°C |
- Temperature Max (Ts(max)) | 200°C | |
- Time (Min to Max) (ts) | 60 – 120 secs | |
Average ramp up rate (Liquidus Temp (TL) to peak | 5°C/second max | |
TS(max) to TL - Ramp-up Rate | 5°C/second max | |
Reflow | - Temperature (TL) (Liquidus) | 217°C |
- Temperature (tL) | 60 – 150 seconds | |
Peak Temperature (TP) | 260°C | |
Time within 5°C of actual peak Temperature (tp) | 20 – 40 seconds | |
Ramp-down Rate | 5°C/second max | |
Time 25°C to peak Temperature (TP) | 8 minutes Max. | |
Wave Soldering | 260°C, 10 seconds max. | |
Hand Soldering | 350°C, 5 seconds max. |
Product Characteristics
Item | Test condition/ Methods | Limited | Standard |
---|---|---|---|
Resistance | Measuring resistance value at room temperature 25℃±5℃ | Refer to Spec | IEC60115-1 4.5 |
ESD Test | 1) Direct Contact (DC): ±6kV; 2) Air Discharge (AD): ±12kV, ±16kV, ±25kV; | ≤±0.5% | AEC-Q200 REV D June 1 |
Short time Overload | 5×Rated power for 5 seconds * 2.5×Rated power for 10 s | ≤±0.5% | MIL-STD-202 Method 210 |
Resistance to Soldering Heat | 260℃± 5℃ time :10sec±1sec | ≤±0.5% | MIL-STD-202 Method 210 |
Temperature Cycling | -55℃ (15min)/+150℃(15min), 1000 cycles | ≤±0.5% | MIL-STD-202 Method107G |
Solderability | 235℃± 5℃, 2s±0.5s | At least 95% of surface area of electrodeshall be covered with new solder | MIL-STD-26E |
High Temperature Exposure | 100hours T=170℃ No power | ≤±0.5% | IEC6011501-4.25 |
Bias Humidity | +85℃, 85% RH ,10%bias, 1000hours | ≤±0.5% | MIL-STD-202 Method103 |
Mechanical shock | Condition C ,100 g’s ,6 msec, 3 mutually perpendicular axes, in 6 directions, three impacts each for a total of 18 times 18 shocks. | ≤±0.5% | MIL-STD-202 Method 213 |
Vibration | The frequency varies from 10HZ to 2000HZ , shall be transferred in 1 min. Amplitude : 100 g’s, 3 directions, 20 min, 12 cycles | ≤±0.5% | MIL-STD-202 Method 201 |
Operational life | Condition D Steady State TA=125℃ at rated power. | ≤±0.5% | MIL-STD-202 Method 108 |
Moisture resistance | No power, t=24hours/cycle,Steps 7a &7b not required | ≤±0.5% | MIL-STD-202 Method 106 |
Tapping & Package
- Storage Conditions: Temperature:5℃~35℃ , Humidity:40%~75%
- Embossed Plastic Tape
Type | Pack | A ±0.2 | B ±0.2 | D0 +0.5-0 | E ±0.1 | F ±0.05 | P0 ±0.1 | P1 ±0.1 | P2 ±0.1 | W ±0.2 | D1 ±0.05 | t ±0.15 |
---|---|---|---|---|---|---|---|---|---|---|---|---|
2817 | Emboss | 4.80 | 7.20 | 1.50 | 1.75 | 7.50 | 4.00 | 6.00 | 2.00 | 16.00 | 1.50 | 1.20 |
Packaging
Quantity: 1, 500pcs
16mm wide tape on 330mm(13 inch) diameter reel -specification EIA Standard 481.
Storage
1. The temperature condition must be controlled at 25±5℃, The R.H. must be controlled at 60±15% Store in accordance with this requirement, and the validity period is two years after the date of manufacture。
2. Please avoid the mentioned harsh environment below when storing to ensure product performance and its’ weldability. Places exposed to sea breeze or other corrosive gas,such as Cl2 、H2S 、NH3、 SO2 and NO2.
3. When the product is moved and stored, please ensure the correct orientation of the box.Do not drop or squeeze the box. Otherwise, the electrode or the body of the product may be damaged.