LMJ12
Description
- Proprietary processing technique produces extremely low resistance values
- Very low inductance
- Low thermal EMF
- Metallic Material
Part Numbering System
Parameter | Standard |
---|---|
Power Rating | 1W |
Resistance Value | 1~100mΩ |
Operating Temperature Range | -55 to +170°C |
Component Temperature Coefficient (TCR) | ± 50 ppm/°C |
Maximum Working Voltage (V) | (P×R)1/2(P \times R)^{1/2} |
Rating Current (A) | (P/R)1/2(P / R)^{1/2} |
P=Power Rating; R=Resistance Value
Standard Electrical Specifications
Type | Rating Power at 70℃ | T.C.R. (ppm/℃) | Resistance Range(mΩ) 0.5%(D) 1.0%( F) 2.0%( G) 5.0%( J) | Meterial | Operating Temperature(℃) |
---|---|---|---|---|---|
LMJ12 | 1W | 50 | 1~100 | R001~R100:MnCu | -55~+170°C |
Dimensions
Unit: Millimeters
Type | L | W | C | T |
---|---|---|---|---|
LMJ 12 | 3.2 ±0.2 | 1.6 ±0.2 | 0.5±0.3 | 0.7± 0.15 |
Recommended land pattern
Resistance Range ( Ω ) | a | b | L |
---|---|---|---|
0.001~0.1 | 1.8±0.1 | 2.3±0.1 | 1.0±0.1 |
Tapping & Package
Type | Pack | A ±0.2 | B ±0.2 | D0 +0.5-0 | E ±0.1 | F ±0.05 | P0 ±0.1 | P1 ±0.1 | P2 ±0.1 | W ±0.2 | T ±0.15 |
---|---|---|---|---|---|---|---|---|---|---|---|
1206 | Paper | 2.00 | 3.60 | 1.50 | 1.75 | 3.50 | 4.00 | 4.00 | 2.00 | 8.00 | 0.81 |
Reel Specification
Type | A | B | C | D | M | W |
---|---|---|---|---|---|---|
1206 | 2.00±0.5 | 13.5±0.5 | 21.00±0.5 | 60.00±1.0 | 178.00±2.0 | 9.00±1.0 |
Product Characteristics
Item | Test condition/ Methods | Limited | Standard |
---|---|---|---|
Resistance | Measuring resistance value at room temperature 25℃±5℃ | Refer to Spec | IEC60115-1 4.5 |
Temperature coefficient of resistance | TCR =(R-R0)/R0(T2-T1)X 106 T1 T2 R0 : resistance of room temperature R: resistance of 125℃ T1: Room temperature T2: Temperature at 125℃ | Refer to Spec | MIL-STD-202 Method 304 |
Short time Overload | 5×Rated power for 5 seconds | ≤±0.5% | MIL-STD-202 Method 210 |
Resistance to Soldering Heat | 260℃± 5℃ time :10sec± 1sec | ≤±0.5% | MIL-STD-202 Method 210 |
Temperature Cycling | -55℃ (30min)/+125℃(30min), 1000 cycles | ≤±0.5% | MIL-STD-202 Method107G |
Low temperature Storage | -55℃ for 1000hours, No power | ≤±0.5% | MIL-STD-26E |
High Temperature Storage | 125℃ for 1000hours, No power | ≤±1% | IEC6011501-4.25 |
Bias Humidity | +85℃, 85% RH ,10%bias, 1.5 h "ON", 0.5 h "OFF" ,1000hours | ≤±0.5% | MIL-STD-202 Method103 |
Joint Strength of Solder | Soldered on the bending test plate, put on the bending testing machine, pressed under force in the center of the test plate, measure its resistance variance rate under load | ≤±0.5% | JIS-C5201 |
Solderability | Temperature of Solder :245±5℃ Dipping time:3±1s | Solder coverage over 95% | IEC60115-1 4.17 |
Load life | 1000 h at 70 °C , 1.5 h "ON", 0.5 h "OFF" | ≤±1% | JIS-C5201 |
Operational life | 125℃± 3℃, 1000 hours, at rated power | ≤±0.5% | MIL-STD-202 Method 108 |
Derating Curve
Packaging
Quantity: 5, 000pcs
8mm wide tape on 178mm(7 inch) diameter reel -specification EIA
Standard 481.