ALMN25

ALMN25

Description

  • Proprietary processing technique produces extremely low resistance values
  • Very low inductance
  • Low thermal EMF
  • Metallic Material
  • AEC-Q200 qualified available

Part Numbering System 

ALMN25

Parameter Standard
Power Rating 1~100mΩ : 2~3W
Resistance Value 1~100mΩ
Operating Temperature Range -55 to +170°C
Component Temperature Coefficient (TCR) ± 50 ppm/°C
Maximum Working Voltage (V) (P x R)1/2
Rating Current (A) (P / R)1/2

P=Power Rating; R=Resistance vaIue

 

Standard Electrical Specifications

    Type   Rating Power at 70℃     T.C.R.   (ppm/℃) Resistance Range(mΩ) ±0.5%(D) ±1.0%(F) ±2.0%(G) ±5.0%(J)     Meterial     Electrode     Operating Temperature(℃)
  ALMN25J   2W     50 1-4     CuMn R001-R004:Wide     -55~+170°C
2-10 R002-R100:Narrow
  ALMN25H   2W&3W
1-4 R001-R004:Wide
2-100 R002-R100:Narrow


Construction

ALMN25

Unit: Millimeters

Type Power L W C t
  ALMN25 2W 6.4 ±0.2 3.2 ±0.2 0.95±0.25 (Narrow) 0.9±0.2
3W 6.4 ±0.2 3.2 ±0.2 0.95±0.25 (Narrow) 0.9±0.2
2.1±0.25(Wide)

 

Recommend land pattern

ALMN25

Unit: Millimeters

Resistance Range ( Ω ) a b L
0.001-0.004(Wide) 4.0±0.1 3.1±0.1 1.3±0.1
0.002~0.100(Narrow) 4.0±0.1 2.1±0.1 4.1±0.1

Product structure diagram 

ALMN25

 

Power Derating Curve

For resistors operated in ambient temperatures 70°C, power ratingshall be derated inaccording with the curve below:

ALMN25


Recommended Solder Curve

ALMN25

Reflow Condition Pb – Free assembly
  Pre heat - Temperature Min (Ts(min)) 150°C
- Temperature Max (Ts(max)) 200°C
- Time (Min to Max) (ts) 60 – 120 secs
Average ramp up rate (Liquidus Temp (TL) to peak 5°C/second max
TS(max) to TL - Ramp-up Rate 5°C/second max
  Reflow - Temperature (TL) (Liquidus) 217°C
- Time (tL) 60 – 150 seconds
Peak Temperature (TP) 260°C
Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
Wave Soldering 260°C, 10 seconds max.
Hand Soldering 350°C, 5 seconds max.

 

Product Characteristics

Item Test condition/ Methods Limited Standard
Resistance Measuring resistance value at room temperature 25℃±5℃ Refer to Spec IEC60115-1 4.5
    Temperature coefficient of resistance TCR =(R-R0)/R0(T2-T1)X 106 R0 : resistance of room temperature R: resistance of 125℃ T1: Room temperature T2: Temperature at 125℃     Refer to Spec     MIL-STD-202 Method 304
  Short time Overload Apply  overload for  5  seconds  and  measure  the resistance change rate after standing for 24 hours. 5 times the rated power for 5 seconds   ≤±0.5%   MIL-R-26E
Resistance to  Soldering Heat 260℃± 5℃  time :12sec± 0.5sec ≤±0.5% MIL-STD-202 Method 210
  Solderability Immerse in the furnace at 245 ± 5℃for 3 ± 1 seconds, then take it out and put it under a    magnifying glass to observe the solder area The electrode shall cover more than 95% of new tin. MIL-STD-202 Method 210
Temperature Cycling -55℃ (30min)/+125℃(30min), 1000 cycles ≤±0.5% MIL-STD-202 Method107G
Low temperature Storage -55℃ for 1000hours, No power ≤±0.5% MIL-STD-26E
High Temperature Storage 125℃ for 1000hours, No power ≤±1% IEC6011501-4.25
Bias Humidity +85℃, 85% RH ,10%bias, 1000hours ≤±0.5% MIL-STD-202 Method103
  Mechanical shock Condition C ,100 g’s ,6 msec, 3 mutually perpendicular axes, in 6 directions, three impacts each for a total of 18 times 18 shocks.   ≤±0.5%   MIL-STD-202 Method 213
  Vibration The frequency varies from 10HZ to 55HZ and return to 10HZ, shall be transferred in 1 min. Amplitude : 1.5mm, 3 directions, and 12 hours   ≤±0.5% MIL-STD-202 Method 201
Operational life 70℃± 2℃, 1000 hours, at rated power 1.5 hours “ON”, 0.5 hours “OFF” ≤±1% MIL-STD-202 Method 108

 

Tapping & Package

ALMN25

  Type   Pack A ±0.2 B ±0.2 D0 +0.5-0 E ±0.1 F ±0.05 P0 ±0.1 P1 ±0.1 P2 ±0.1 W ±0.2 D1 ±0.05 T ±0.15
2512 Emboss 3.60 6.90 1.50 1.75 5.50 4.00 4.00 2.00 12.00 1.50 1.20

 

Reel Specification

ALMN25

Type A B C D M W
2512 2.00±0.5 13.50±0.5 21.00±0.5 80.00±1.0 178.00±2.0 13.80±0.5

 

Packaging

Quantity: 4, 000pcs

12mm wide tape on 178mm(7

inch) diameter reel -specification EIA Standard 481.

 

Peel strength of upper belt

Stripping speed: 300 mm / min; The peel force is between 0.1N and 0.7N.

ALMN25

Storage conditions & shelf life

It can be stored for 2 years under closed conditions with temperature of 5 ° C ~ 35 ° C and relative humidity of 40 ~ 75

Please avoid the following harsh environment during storage to avoid affecting the product

performance and solder connectivity: the places with corrosive gases such as sea breeze, Cl2 , H2S, NH3 , SO2 and NO2 shall be stored without direct sunlight.

 

Precautions for product use

When measuring the resistance value before welding, a special resistance meter with high precision shall be used. When measuring, a 4-wire probe or fixture must be used. 4. When measuring parts with a wire    measuring needle, the 4 measuring needles must indeed contact the parts. Avoid damaging the protective layer during manual welding or clamping with tweezers.

When the PCB is divided or fixed on the support, be careful to avoid excessive bending causing mechanical stress to the resistor.

It shall be used within the rated power range within the specification, especially when the power exceeds the rated value, which may affect the reliability of the product

 

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